Low-temperature epoxy is one-component low-temperature curing epoxy adhesive. It can be used in automatic line production with the good performance of fast-cure and drop resistance. It is mainly used for bonding, reinforcement and component protection of electronic parts. The products are widely used in camera module, fingerprint module, speaker, receiver, motor, military headset, PCBA, FPC and other products.
● Customized according to specific needs;
● Fast-cure, suitable for automatic line production;
● Low-temperature cure, Fast-cure;
● Good Toughness, Excellent drop resistance;
● Excellent thermal shock performance, High temperature and humidity resistance;
● Meet EU environment protection requirements, ROHS, Reach, Halogen-free, O-benzene-free, Organotin-free.
| Item | Color | Viscosity (cps/25°C) |
Cure condition | Hardness (shore D) |
Shear strength (MPa, steel/steel) |
Rate of contraction (%) |
Elongation (%) |
|---|---|---|---|---|---|---|---|
| 5100-3 | black | 3000 | 80°C30min | 80 | 20.6 | 0.15 | 2.3 |
| 5213 | black | 4000 | 120°C20min | 80 | 23.6 | 0.16 | 2.8 |
| 5211 | black/white | 12000 | 90°C30min | 79 | 17.2 | 0.5 | 18.1 |
| 5231 | blue | 5220 | 100°C30min | 81 | 21.6 | 0.55 | 15.3 |
| 5221 | black/white | 12400 | 100°C1h | 79 | 20.7 | 0.5 | 12.6 |
