Smartphone

Smartphone application point

Model of application products

Application Glue Model Characteristic
Display screen LCM frame protection PUR, MMA JT8402B/JT6710 Excellent shading ability, high bond strength
FPC bonding UV JT6052R Corrosion resistant, high viscosity product
Camera module Shell bonding UV thermosetting JT6301B UV light/heat curing, low curing shrinkage
Bracket bonding epoxy JT5113S3 Fast curing at low temperature, low glue precipitation rate
lens bonding UV JT6455S1 High bonding strength to LCP/PPA, excellent anti-aging ability
Coil Bonding epoxy JT5308 Excellent drop resistance and high bond strength
Speaker/Handset cover bonding PUR JT8020-5 High bond strength to nickel, high temperature creep resistance
magnetic bonding Anaerobic JT3310/JT3267 High bond strength to zinc and nickel, excellent aging resistance
Sound membrane + dome UV JT6220 Good long-term heat resistance, high bond strength to film
Sound film + coil UV JT6227 High bond strength to PEEK/TPU/TPE, good long-term heat resistance
Vibrator cover bonding PUR JT8008SL/JT8013S3 High bond strength, low cure shrinkage
magnetic bonding Anaerobic JT3310/JT3267 High bond strength to zinc and nickel, excellent aging resistance
Border bonding battery cover bonding PUR JT8148S6B Reworkable, good viscosity stability at 110ºC
TP bonding PUR JT8142B High bonding strength to glass and PC/GF, excellent impact resistance
Battery Solder joint protection UV JT6452 Corrosion resistant, high viscosity product
Thermal Conductivity Silica gel JT1201 High thermal conductivity (~5W/m·K), low temperature curing
Fingerprint lock ring bonding epoxy JT5811S7 High bond strength, low cure shrinkage, low water absorption
bottom padding epoxy JT5801 Good flow at room temperature, compatible with most lead-free solders
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