| Application | Glue | Model | Characteristic |
|---|---|---|---|
| Narrow frame bonding | PUR | JT8020, JT8402B | High bond strength to all substrates, good creep resistance at elevated temperatures |
| Shell bonding | MMA | JT6743 | Fast curing at room temperature, good aging resistance, high bond strength to all substrates |
| Camera Module Application | epoxy, acrylate | JT5113, JT6094, JT6301B | High bond strength to all substrates, especially LCP/Ni, low glue extraction, low cure shrinkage |
| Speaker/Headset Bonding | Acrylate, Epoxy, Acrylate | JT3310, JT5102S2, JT6069 | High bond strength to Ni/Zn, good aging resistance |
| Battery BMS Protection | epoxy, acrylate | JT5801, JT6452 | JT5801 has good flowability at room temperature, stable electrical conductivity and good aging resistance |
| Touchpad Application | epoxy | JT6426 | First activated with UV light of wavelength 254-405nm, then finally cured at room temperature for 24 hours, excellent impact resistance |
| Hardware Application | Acrylate, Epoxy | JT3310, JT5308 | High temperature resistance, excellent impact resistance, good aging resistance |
| PCBA Protection | Acrylate | JT6062, JT6452 | Good aging resistance, excellent sweat resistance in shaded areas JT6062 can be moisture cured |
| Screw lock | Acrylate | JT3310 | High bond strength to zinc chromate and nickel plated surfaces, excellent moisture resistance (eg 85 °C /85%RH for 7 days) |
| Thermal Silicon | Silica gel | JT1202 | Neutral, non-corrosive thermal conductivity to conventional metals |